One part, heat curing, biocompatible epoxy compound
Key Features
One component, no mix system
USP Class VI certified
Passes ISO 10993-5 for cytotoxicity
Resists repeated sterilization
Master Bond EP3HTMed is a USP Class VI compliant epoxy offering easy processing, excellent strength, and bonding. It requires no mixing and cures with heat (250°F for 20-30 min or 300°F for 5-10 min. To optimize properties post curing with heat is recommended. This solvent-free system has unlimited working life and low shrinkage. It bonds well to diverse substrates including glass, metals, ceramics, most plastics, provides good electrical insulation, and withstands temperatures from -60°F to +400°F. EP3HTMed exhibits superior resistance to chemical sterilants, EtO, radiation, and especially autoclaving. It is brown to tan in color. This medical grade formulation is ideal for disposable and non-disposable medical device manufacturing requiring fast, high-performance bonding where heat curing at 250°F is practical.