Production system FlexAL

The FlexAL atomic layer deposition (ALD) system offers a broad range of optimised high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber. Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber RF biased electrode option available for control of film properties Industry-standard cassette to cassette handling for higher throughput Maximum flexibility in the choice of precursors, process gases, hardware features and options Optimised to maintain low-damage, high-quality substrates Removable liners allow for easy chamber maintenance Low temperature to enable high-quality deposition on temperature-sensitive surfaces Overview The ALD product family encompasses a range of tools to meet the varied demands of academia, corporate R&D and small-scale production. Oxford Instruments has an extensive process library, and new processes are continually being developed. We provide free ongoing process support for the lifetime of any ALD tool, offering advice on developing new materials and continued access to our latest ALD process developments including new process recipes. Ions play an important role in plasma ALD processes. Ions can improve film quality, particularly for nitrides and at lower deposition temperatures. However, certain interfaces and substrates can be sensitive to ions leading to device damage. The FlexAL ALD system precisely controls plasma ions with an advanced plasma source and automatic matching unit (AMU), allowing the maximum benefit of plasma whilst minimizing damage.