Production system PlasmaPro 800 RIE

The PlasmaPro 800 offers a flexible solution for reactive ion etching (RIE) processes on large wafer batches and 300mm wafers, in a compact footprint, open-loading system. The large wafer platen allows for production scale batch processing and 300mm wafer handling. High performance processes Excellent substrate temperature control Precise process control Proven processes for 300mm single wafer Failure Analysis Features The PlasmaPro 800 with a 460mm diameter table offers full 300mm or large batch 43 x 50mm (2”) capacity, enabling full production solutions and establishing the PlasmaPro 800 as a well proven market leading product. Allowing maximum process flexibility for compound semiconductor, optoelectronics, and photonics applications, the PlasmaPro 800 provides: Large electrode - Low Cost of Ownership Etch end point detection - Reliability and serviceability Endpoint detection by laser interferometry and/or optical emission spectroscopy - Can be fitted to enhance etch control Options of a 4-, 8- or 12-line gas pod - Provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool Close-coupled turbo pump - High pumping speed and excellent base pressure Datalogging - Traceability and history of chamber and process conditions Fluid-cooled and/or electrically-heated electrodes - Excellent electrode temperature control and stability Applications Failure analysis dry etch de-processing using our specially configured failure analysis tools, with RIE and dual-mode RIE/PE processes ranging from packaged chip and die etch through to full 300mm wafer etch