Semi-automatic packing machine XENA - III

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The XENA-III, Semi-Automatic Blister Packing Machine offers a 3-in-1 manufacturing process for low volume blister packaging including forming, sealing and perforating/cutting. All operations needed for blister packaging are carried out simply and quickly on the same machine, by changing and replacing the format-related parts and with no need to resort to wrenches or specialized personnel. Materials : PVC/ALU, PVDC/ALU, PETG/ALU, PVC/CRAFT PAPER, ALU/ALU Max. Forming Depth : PVC/ALU : 15mm, ALU/ALU : 10mm Blister Sizes : 136*100mm [Blister per cycle : 2] For PVC/ALU 100*68mm [Blister per cycle : 1] For ALU/ALU Temperature : 20~200°C Common Tool : Forming Heating Tool (Forming Upper Mold) Sealing Heating Tool (Sealing Upper Mold) Cutting Tool ( Cutting board & Blade) Compressed Air : 5bar Power : 220V(1Ph), 50/60Hz, 2KVA 7” Touch Screen Auto Temperature Control Automatic Step Control Format parts Detection Sensor Easy setup HMI Tool-less changeover of format parts in less then 90 seconds.